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Extension of Solvent-Assisted Linker Exchange to Supported Metal–Organic Framework Thin Films

Publication
85

X. Krull, C. Tyler, M. Neurock, and J. T. Hupp, Extension of Solvent-Assisted Linker Exchange to Supported Metal–Organic Framework Thin Films, Langmuir, 2026, 42, 1877-1887. DOI: 10.1021/acs.langmuir.5c02748